So I'm designing a two-layer PCB and I'm very inexperienced. A third-party company will fabricate them.
Now, I have a PTH part with a number of closely spaced pins (and there is no SMD equivalent of this part). I can greatly simplify routing by running traces between certain pins. However, I can't do this unless I eliminate the pads for certain pins on one side of the board (to make clearance for the trace).
If I do this, that means that for those pins, only one side of the PCB can get solder even though the pin will stick through. So my question is: Given that this board's fabrication, population, and soldering is automated, can I leave pads off of one side of a PTH connection and run traces near it without issue? I guess I'm kind of imagining like, solder leaking through the holes or some weird mechanical issue with the partially-supported pins.
Or should I just come up with a more complex routing that doesn't pass in between closely spaced pins? Or ... maybe I can just eliminate like half the pad on one side of the board or something like that? Or, is there a different fabrication process that I could look for? I just don't really have any concept of the quirks that come up in fabrication, so I can't really make a good judgment call.
Unsure if relevant but expected operating temperature range is 0 - 40 °C, varying moisture (exposed to outdoor humidity but not rain water). No significant mechanical shocks or stresses expected (the board does have some jacks on it but they're all strain relieved with mounting points).
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